Advanced PVD Coating Machines for Industrial Applications
Your Trusted Partner in Vacuum Coating Equipment
Who We are
SIMVACO is a manufacturer of industrial vacuum coating machines, specializing in magnetron sputtering and multi-arc PVD systems, PECVD equipment, and roll-to-roll (R2R) coating lines. Since 2010, we have developed equipment for thin-film applications across automotive components, electronics, glass, advanced packaging, hardware, and flexible substrates.
Through-Glass Via (TGV) Inline Sputtering System
SIMVACO’s Inline Magnetron Sputtering System is a modular, high-vacuum PVD platform designed for Through-Glass Via (TGV) metallization and advanced packaging applications involving glass substrates.
Horizontal Inline PVD Coating Machine
SIMVACO’s ITO PVD coating systems are designed for uniform indium tin oxide (ITO) thin-film deposition on glass and plastic substrates. Using magnetron sputtering technology, these systems support the production of transparent conductive films for display panels, touchscreens, and other optoelectronic applications, with film properties tailored to specific application requirements.
SIMVACO’s Roll-to-Roll (R2R) PVD and PECVD systems are designed for continuous thin-film deposition on flexible substrates, including PET, PI, and metal foils. Potential applications include flexible copper-clad laminates (FCCL), flexible electronics, photovoltaic devices, high-barrier packaging films, flexible touchscreens, optical coatings, and copper metallization for battery components. Process suitability depends on the substrate, film material, and required coating performance.
Superhard Coating PVD System for Cutting Tools
SIMVACO’s PVD ion plating systems deliver uniform, wear-resistant hard coatings for cutting tools, molds, and industrial components, helping improve surface hardness and extend service life.
Materials & Components
SIMVACO supplies high-quality vacuum materials & components essential for advanced vacuum systems and thin-film deposition. Our offerings include vacuum pumps, valves, seals, and high-purity targets, ideal for applications in electronic, optical, hard and decorative coating industries.
Discover SIMVACO
Blog posts
View all-
ITO vs. ITO/Ag/ITO: Film Performance, Sputterin...
Transparent Conductive Films · PVD Engineering Indium tin oxide (ITO) is an established transparent conducting oxide used in displays, touch interfaces and other products that require electrical conductivity with visible-light...
ITO vs. ITO/Ag/ITO: Film Performance, Sputterin...
Transparent Conductive Films · PVD Engineering Indium tin oxide (ITO) is an established transparent conducting oxide used in displays, touch interfaces and other products that require electrical conductivity with visible-light...
-
From Wafer to Panel: The Role of Large-Area PVD...
Explore how large-area PVD enables panel-level advanced packaging, including RDL, Cu seed, TGV and glass core metallization on 600 × 600 mm panels.
From Wafer to Panel: The Role of Large-Area PVD...
Explore how large-area PVD enables panel-level advanced packaging, including RDL, Cu seed, TGV and glass core metallization on 600 × 600 mm panels.
-
10 Key Factors to Consider When Selecting a PVD...
Choosing the right industrial PVD coating system requires more than comparing equipment specifications. This guide explains how to evaluate PVD technologies, vacuum systems, chamber design, process control, automation, production efficiency,...
10 Key Factors to Consider When Selecting a PVD...
Choosing the right industrial PVD coating system requires more than comparing equipment specifications. This guide explains how to evaluate PVD technologies, vacuum systems, chamber design, process control, automation, production efficiency,...
-
What is Through Glass Via?
Through Glass Via (TGV) is a vertical interconnect technology for semiconductor packaging that enables copper-based electrical connections through glass substrates. It is widely used in glass interposers, AI chiplets, RF...
What is Through Glass Via?
Through Glass Via (TGV) is a vertical interconnect technology for semiconductor packaging that enables copper-based electrical connections through glass substrates. It is widely used in glass interposers, AI chiplets, RF...