Pioneering Through Glass Via Sputtering System TGV Metallization SIMVACO
Pioneering Through Glass Via Sputtering System TGV Metallization SIMVACO
1. Product Overview
The SIMVACO Inline Magnetron Sputtering Platform is a modular high-vacuum thin-film deposition system designed for Through Glass Via (TGV) metallization and glass-based advanced packaging applications.
The platform enables stable deposition of multilayer thin films including adhesion layers, diffusion barrier layers and conductive seed layers, providing a reliable metallization foundation for subsequent copper electroplating and high-density interconnect formation.
As advanced packaging technologies continue to evolve toward finer pitch interconnects, larger panel formats and higher signal frequencies, glass substrates are increasingly adopted due to their superior dimensional stability, low dielectric loss and excellent high-frequency electrical performance compared with traditional organic materials.
Reliable metallization of glass surfaces and via structures requires precise control of film adhesion, uniformity, stress, continuity and contamination. The SIMVACO platform is designed to address these requirements through integrated plasma treatment, multi-chamber inline vacuum architecture and controlled sputtering processes.
2. Process Challenges
Glass-based advanced packaging introduces several critical process challenges:
- Low intrinsic adhesion on glass surfaces
- Uniform deposition across large-area substrates
- Continuous copper seed layer formation
- Dense and stable diffusion barrier formation
- Low film stress for reliability
- High aspect-ratio via coverage stability
- Particle control in continuous vacuum processing
- Stable multilayer interface formation
- High process repeatability for volume manufacturing
The platform is engineered to provide a scalable solution for these manufacturing requirements in an inline high-vacuum environment.
3. Integrated Process Capability
The system supports a continuous vacuum-based metallization workflow without breaking vacuum between key process steps.
Typical process flow includes:
- Plasma surface cleaning and activation
- Surface conditioning and contaminant removal
- Adhesion layer deposition
- Diffusion barrier layer deposition
- Copper seed layer deposition
- Sequential multilayer thin-film deposition
- Vacuum transfer between isolated process chambers
All processes are performed under controlled high-vacuum conditions to minimize oxidation, contamination and interface degradation.
4. Material System Capability
The platform supports three primary thin-film material families used in advanced semiconductor packaging.
Metallic Materials
Used for adhesion layers, seed layers and conductive functional layers:
- Copper (Cu)
- Titanium (Ti)
- Chromium (Cr)
- Tantalum (Ta)
- Nickel (Ni)
Nitride Materials
Used for diffusion barrier and interface control layers:
- Titanium Nitride (TiN)
- Tantalum Nitride (TaN)
Oxide Materials (Reactive Sputtering Mode)
When configured with reactive gas control, the system supports oxide thin-film formation, including:
- Silicon Dioxide (SiO₂)
- Aluminum Oxide (Al₂O₃)
These films are typically used for dielectric, passivation or functional interface engineering applications.
5. Platform Architecture
The system is based on a modular inline high-vacuum architecture designed for scalable semiconductor manufacturing.
Key modules include:
- Automated load / unload system
- Load-lock vacuum chambers
- Plasma treatment module
- Multi-chamber sputtering system
- Independent vacuum transfer system
- High-vacuum pumping system
- Modular cathode configuration
- Process recipe management system
- SPC process monitoring
- SECS/GEM and MES integration
Independent process isolation ensures low particle transfer and stable process repeatability.
6. Engineering Features
- Continuous inline high-vacuum processing
- Independent vacuum process zones
- Multi-cathode architecture
- DC / RF / HiPIMS compatibility
- Planar or cylindrical cathode configurations
- Closed-loop process control
- Automatic target utilization management
- Low particle process design
- Recipe traceability and data logging
- Predictive maintenance capability
- High equipment uptime design
7. Substrate Compatibility
Typical supported formats:
- 510 × 515 mm
- 600 × 600 mm
Compatible substrates:
- Glass Core
- Glass Interposer
- Through Glass Via (TGV) Panels
- Panel-Level Glass Substrates
Custom substrate sizes and handling systems can be configured based on application requirements.
8. Applications
- Through Glass Via (TGV) Metallization
- Glass Core Manufacturing
- Glass Interposer Manufacturing
- Panel-Level Glass Packaging (PLP)
9. Target End Markets
- AI Accelerators
- High Performance Computing (HPC)
- Chiplet Packaging
- Co-Packaged Optics (CPO)
- Optical Communication Systems
- High-Speed Data Centers
- Advanced Semiconductor Packaging
10. Key Advantages
- High-uniformity thin-film deposition on large-area glass substrates
- Stable adhesion and barrier layer formation
- Continuous copper seed layer integrity
- Low particle generation in inline vacuum transfer
- High process repeatability for mass production
- Modular system scalability from R&D to HVM
- Flexible configuration for multiple metallization schemes
- Manufacturing-ready process integration
11. Why SIMVACO
SIMVACO specializes in advanced vacuum thin-film deposition platforms for semiconductor packaging and functional materials engineering.
With deep expertise in inline sputtering system design, modular vacuum architecture and process integration, SIMVACO delivers scalable metallization platforms for glass-based advanced packaging applications.
The company provides not only deposition equipment, but integrated process platforms enabling reliable, repeatable and manufacturing-ready interconnect formation for next-generation heterogeneous integration.
