Research High Barrier Film PECVD Thin Film Deposition Machine SIMVACO
Research High Barrier Film PECVD Thin Film Deposition Machine SIMVACO
The laboratory high-barrier films PECVD coating machine is designed for precise deposition of thin-film barrier layers on PI substrates. This compact system is ideal for research and small-scale production, delivering consistent and high-performance coatings for applications requiring advanced moisture and oxygen resistance.
Key Features
- advanced PECVD Technology: Enables uniform deposition of multilayer barriers with materials like SiOx, AlOx, and siloxanes.
- Substrate Flexibility: Compatible with PI films and perforated designs, supporting a variety of applications.
- Process Control: Real-time monitoring ensures film uniformity (±1%) and deposition precision.
- Heating Capability: Substrate heating up to 200°C for enhanced coating quality.
Technical Specifications
| Parameter | Specification |
|---|---|
| Deposition Technology | PECVD |
| Vacuum Pressure | ≤1×10⁻⁴ Pa |
| Coating Uniformity | ±5% |
| Film Thickness Range | 10nm - 200nm |
| Deposition Speed | Up to 2nm/s |
| Substrate Heating | Up to 200°C |
| Materials | SiOx, AlOx, Siloxanes |
Applications
- Flexible Electronics: Barrier films for protecting foldable and wearable devices.
- Advanced Packaging: High-barrier coatings for specialized R&D in packaging solutions.
- Material Development: Prototyping thin-film technologies on PI substrates.
This machine offers unparalleled precision and versatility for R&D and niche applications. Contact us today to learn more about how it can elevate your laboratory’s capabilities.
