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Leading High Speed PECVD Coating Machine for High-Barrier PET Films
Leading High Speed PECVD Coating Machine for High-Barrier PET Films
Our High-Barrier Film PECVD Coating Machine is specifically designed for the production of high-performance barrier films, utilizing advanced Plasma Enhanced Chemical Vapor Deposition (PECVD) technology. This production line is optimized for continuous operation, achieving production speeds of up to 100 m/min, making it ideal for the packaging industry.
PECVD Technology for High-Barrier Films
- Sandwich Structure Coating: Our machine is capable of producing multilayer coatings in a sandwich structure, enhancing the barrier properties against gases and moisture. This configuration is critical for applications requiring high durability and protection
- High Throughput: Designed for industrial-scale production with a speed of up to 100 m/min, ensuring efficiency and meeting large-volume demands.
- Material Compatibility: Optimized for PET substrates, supporting multilayer coatings with materials such as SiOx and AlOx.
- Process Stability: Real-time process control ensures consistent thickness and barrier performance across the substrate.
- Flexible Gas Management System: The precise gas flow control system enables the use of various precursor gases, allowing for customization of film properties based on specific application requirements.
- Inline Design: Continuous coating process minimizes downtime and maximizes productivity.
Technical Specifications
Parameter | Specification |
---|---|
Deposition Technology | PECVD |
Substrate Type | PET Films |
Vacuum Pressure | ≤5×10^-4 Pa |
Coating Uniformity | ±5% |
Film Thickness Range | 10nm - 200nm |
Deposition Speed | Up to 100 m/min |
Automation | Fully automated with advanced process control |
Material Options | SiO2, AlOx, other barrier materials |
Production Configuration | Inline continuous coating |
Inline Production for High-Performance Barrier Films
- Continuous High-Speed Coating: Inline design supports uninterrupted coating of PET substrates at high speeds, reducing operational costs.
- Enhanced Barrier Properties: Multilayer films achieve superior oxygen and moisture resistance, meeting stringent packaging requirements.
- Customizable Configuration: Modular design supports additional coating chambers for enhanced functionality or higher throughput.
- Process Control: Real-time monitoring ensures film integrity and adherence to quality standards.
Applications
- Food Packaging: Provides high-barrier films that extend shelf life by effectively blocking oxygen and moisture, making it suitable for food products.
- Pharmaceutical Packaging: Ensures that sensitive medical products are protected from environmental factors, maintaining their efficacy and safety.
-
Electronics Packaging: Ideal for packaging electronic components that require protection from moisture and contaminants, such as OLED dispaly.
Advantages
- Consistent Barrier Quality: Maintains precise layer thickness and high-performance barrier properties.
- High Throughput: Supports large-scale production with minimal downtime.
- Material Versatility: Compatible with advanced barrier materials for various applications.
- Cost Efficiency: Optimized process reduces material and energy waste.
- Scalability: Designed to adapt to increasing production demands and evolving industry requirements.
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