Skip to product information
1 of 1

Laboratory PECVD Coating Equipment for High-Barrier Film PI Substrate

Laboratory PECVD Coating Equipment for High-Barrier Film PI Substrate

The laboratory high-barrier films PECVD coating equipment is specifically designed for the development and testing of advanced thin-film barrier coatings. Optimized for R&D and small-scale production, it provides consistent, high-performance coatings on substrates like PI (polyimide) films. With the ability to process perforated films and deposit multilayer coatings using materials like SiOx and siloxanes, this system is ideal for applications requiring superior oxygen and moisture resistance.

Key Features

  • Advanced PECVD Technology: Enables precise deposition of barrier layers with controlled optical, physical, and chemical properties.
  • Multilayer Coating Capability: Supports SiOx, AlOx, and siloxane materials for creating complex multilayer structures.
  • Substrate Versatility: Compatible with PI films, including perforated types, to support innovative applications.
  • High Coating Uniformity: Ensures uniform film thickness with ±2% precision across the substrate.
  • Integrated Process Monitoring: Real-time control over parameters such as plasma density, deposition rate, and vacuum level to achieve consistent results.

Technical Specifications

Parameter Specification
Deposition Technology PECVD
Chamber Size 1200×600×500 mm
Vacuum Pressure ≤1×10⁻⁴ Pa
Coating Uniformity ±2%
Film Thickness Range 10nm - 200nm
Deposition Speed Up to 2nm/s
Substrate Heating Up to 300°C
Coating Materials SiOx, AlOx, Siloxane
Substrate Compatibility PI films, including perforated structures

Applications

  • Flexible Electronics: Development of barrier films for protecting flexible and foldable electronic components.
  • Packaging R&D: Prototyping high-barrier films for packaging applications requiring advanced moisture and oxygen resistance.
  • Specialized Industrial Coatings: Testing and small-batch production of barrier films for industrial applications.
  • Innovative Material Development: Researching and developing coatings on PI substrates for unique applications such as perforated film technologies.

This system delivers the precision and flexibility needed to explore next-generation barrier film technologies. Its ability to handle diverse materials and perforated substrates ensures versatility for a wide range of laboratory-scale operations. Contact us to learn more via simon@simvaco.com.

View full details